(0,80mm) .0315" dsec series dsec?50?01?l?05.5?2?ra dsec?30?01?l?05.5?2?ra accepts two individual cards for low pro le stack or ?ual stack card set with industry standard 7mm board spacing rugged edge rate contacts designed for signal integrity solder charged terminations for easy board processing www.samtec.com www.samtec.com f-210 for complete speci cations and recommended pcb layouts see www.samtec.com? dsec insulator material: black liquid crystal polymer contact: copper alloy plating: au or sn over 50? (1,27?) ni current rating: testing now! operating temp: -55? to +125? card insertion depth: (5,94mm) .234" nominal rohs compliant: ye s processing: max processing temp: 230? for 60 seconds, or 260? for 20 seconds 3x lead?free solderable: ye s note: some lengths, styles and options are non-standard, non-returnable. specifications ?l = 10" (0,25m) gold on contact, matte tin on tail no. of positions dsec lead style solder type ra ?30, ?40, ?50 (per row) ?01 = (1,60mm) .062" thick card ?05.5 = (5.5mm) .217" ?07.0 = (7mm) .276" ?2 = lead-free tin alloy 96.5% sn/ 3% ag/.5% cu solder crimp plating option board spacing (0,80) .0315 (12,96) .510 (0,64) .025 (9,00) .354 (1,32) .052 dia no. of positions x (0,80) .0315 + (7,75) .305 no. of positions x (0,80) .0315 + (5,72) .225 b (2,15) .085 (3,30) .130 (1,15) .045 application typical application mates with: 1,60mm (.062") thick cards also available ? tin-lead solder charge ? other card spacings ? single card elevated ? other plating options call samtec. board spacing ?05.5 ?07.0 (5,50) .217 (7,00) .276 a board spacing ?05.5 ?07.0 (13,60) .535 (15,10) .594 b (1,65) .065" a dual stack edge card socket application
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